(used in wedge bonding)

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• Ball bonding — is a type of wire bonding, and is the most common way to make the electrical interconnections between a microchip and the outside world as part of semiconductor device fabrication.Gold or copper wire can be used, though gold is more common… …   Wikipedia

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• Adhesive — Glue redirects here. For other uses, see Glue (disambiguation). For the band, see Adhesive (band). Nitrocellulose adhesive outside a tube An adhesive, or glue, is a mixture in a liquid or semi liquid state that adheres or bonds items together.… …   Wikipedia

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• Germany — /jerr meuh nee/, n. a republic in central Europe: after World War II divided into four zones, British, French, U.S., and Soviet, and in 1949 into East Germany and West Germany; East and West Germany were reunited in 1990. 84,068,216; 137,852 sq.… …   Universalium

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